Description

_{Edition – 39th}

The Semiconductor & Sensor Packaging Expo 2025, part of the 39th NEPCON JAPAN, is a premier event focused on electronics R&D, manufacturing, and packaging technologies. It showcases advancements in semiconductor and sensor packaging, connecting industry leaders, innovators, and technology enthusiasts. The event is scheduled for January 22-24, 2025, at Tokyo Big Sight, Japan, and serves as a key platform for networking and exploring cutting-edge solutions in electronics​.